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Am29F016D Known Good Die
Data Sheet
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SUPPLEMENT
Am29F016D Known Good Die
16 Megabit (2 M x 8-Bit) CMOS 5.0 Volt-only, Sector Erase Flash Memory--Die Revision 1
DISTINCTIVE CHARACTERISTICS
5.0 V 10%, single power supply operation -- Minimizes system level power requirements Manufactured on 0.23 m process technology High performance -- 120 ns access time Low power consumption -- 25 mA typical active read current -- 30 mA typical program/erase current -- <1 A typical standby current (standard access time to active mode) Flexible sector architecture -- 32 uniform sectors of 64 Kbytes each -- Any combination of sectors can be erased. -- Supports full chip erase -- Group sector protection: A hardware method of locking sector groups to prevent any program or erase operations within that sector group Temporary Sector Group Unprotect allows code changes in previously locked sectors Embedded Algorithms -- Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors -- Embedded Program algorithm automatically writes and verifies bytes at specified addresses Minimum 1 million erase cycles guaranteed Compatible with JEDEC standards -- Pinout and software compatible with single-power-supply Flash standard -- Superior inadvertent write protection Data# Polling and toggle bits -- Provides a software method of detecting program or erase cycle completion Ready/Busy output (RY/BY#) -- Provides a hardware method for detecting program or erase cycle completion Erase Suspend/Resume -- Suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the erase operation Hardware reset pin (RESET#) -- Resets internal state machine to the read mode Tested to datasheet specifications at temperature Quality and reliability levels equivalent to standard packaged components 20-year data retention at 125C
Publication# 26244 Rev: A Amendment/+1 Issue Date: June 11, 2002
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GENERAL DESCRIPTION
The Am29F016D in Known Good Die (KGD) form is a 16 Mbit, 5.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. A sector is typically erased and verified within one second. The device is erased when shipped from the factory. The hardware sector group protection feature disables both program and erase operations in any combination of the eight sector groups of memory. A sector group consists of four adjacent sectors. The Erase Suspend feature enables the system to put erase on hold for any period of time to read data from, or program data to, a sector that is not being erased. True background erase can thus be achieved. The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations during power transitions. The host system can detect whether a program or erase cycle is complete by using the RY/BY# pin, the DQ7 (Data# Polling) or DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device automatically returns to the read mode. A hardware RESET# pin terminates any operation in progress. The internal state machine is reset to the read mode. The RESET# pin may be tied to the system reset circuitry. Therefore, if a system reset occurs during either an Embedded Program or Embedded Erase algorithm, the device is automatically reset to the read mode. This enables the system's microprocessor to read the boot-up firmware from the Flash memory. AMD's Flash technology combines years of Flash memory manufacturing experience to produce the h i gh e s t l e v el s o f q ua l ity, r el ia b il it y, an d c o s t effectiveness. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection.
Am29F016D Features
The Am29F016D is a 16 Mbit, 5.0 volt-only Flash memory organized as 2,097,152 bytes of 8 bits each. The 2 Mbytes of data are divided into 32 sectors of 64 Kbytes each for flexible erase capability. The 8 bits of data appear on DQ0-DQ7. The Am29F016D is manufactured using AMD's 0.32 m process technology. This device is designed to be programmed in-system with the standard system 5.0 volt VCC supply. A 12.0 volt VPP is not required for program or erase operations. The device can also be programmed in standard EPROM programmers. The standard device offers an access time of 120 ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus contention, the device has separate chip enable (CE#), write enable (WE#), and output enable (OE#) controls. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0 volt Flash or EPROM devices. The device is programmed by executing the program command sequence. This invokes the Embedded Program algorithm--an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The device is erased by executing the erase command sequence. This invokes the Embedded Erase algorithm--an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin.
Electrical Specifications
Refer to the Am29F016D data sheet, publication number 21444, for full electrical specifications on the Am29F016D in KGD form.
PRODUCT SELECTOR GUIDE
Family Part Number Speed Option (V CC = 5.0 V 10%) Max Access Time, tACC (ns) Max CE# Access, tCE (ns) Max OE# Access, tOE (ns) Am29F016D KGD -120 120 120 50
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DIE PHOTOGRAPH
DIE PAD LOCATIONS
10 2 1 38 30
AMD logo location
11
21
22
29
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PAD DESCRIPTION (RELATIVE TO DIE CENTER)
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Signal VCC RESET# A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 DQ3 VSS VSS VCC DQ4 DQ5 DQ6 DQ7 RY/BY# OE# WE# A20 A19 A18 A17 A16 A15 A14 A13 A12 CE# Pad Center (mils) X Y 31.30 90.86 -32.75 94.54 -42.74 90.77 -48.89 90.77 -55.27 90.77 -61.10 90.77 -67.48 90.77 -73.63 90.77 -80.01 90.77 -86.16 90.77 -85.72 -90.77 -79.88 -90.77 -74.42 -90.77 -68.59 -90.77 -58.60 -95.09 -47.60 -95.09 -34.33 -95.09 -23.34 -95.09 -14.38 -94.83 -8.96 -94.83 -3.54 -95.03 16.33 -95.09 27.32 -95.09 40.59 -95.09 51.59 -95.09 62.06 -90.77 72.14 -90.77 79.49 -90.77 85.87 -90.77 82.54 90.77 76.71 90.77 71.25 90.77 65.41 90.77 59.95 90.77 54.12 90.77 48.66 90.77 42.82 90.77 37.36 90.77 Pad Center (millimeters) X Y 0.80 2.31 -0.83 2.40 -1.09 2.31 -1.24 2.31 -1.40 2.31 -1.55 2.31 -1.71 2.31 -1.87 2.31 -2.03 2.31 -2.19 2.31 -2.18 -2.31 -2.03 -2.31 -1.89 -2.31 -1.74 -2.31 -1.49 -2.42 -1.21 -2.42 -0.87 -2.42 -0.59 -2.42 -0.37 -2.41 -0.23 -2.41 -0.09 -2.41 0.41 -2.42 0.69 -2.42 1.03 -2.42 1.31 -2.42 1.58 -2.31 1.83 -2.31 2.02 -2.31 2.18 -2.31 2.10 2.31 1.95 2.31 1.81 2.31 1.66 2.31 1.52 2.31 1.37 2.31 1.24 2.31 1.09 2.31 0.95 2.31
Note: The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
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PAD DESCRIPTION (RELATIVE TO VCC)
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Signal VCC RESET# A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 DQ3 VSS VSS VCC DQ4 DQ5 DQ6 DQ7 RY/BY# OE# WE# A20 A19 A18 A17 A16 A15 A14 A13 A12 CE# Pad Center (mils) X 0.00 -64.05 -74.04 -80.19 -86.57 -92.41 -98.79 -104.94 -111.32 -117.47 -117.02 -111.19 -105.73 -99.89 -89.90 -78.91 -65.64 -54.64 -45.69 -40.26 -34.84 -14.98 -3.98 9.29 20.28 30.75 40.84 48.19 54.57 51.24 45.41 39.94 34.11 28.65 22.81 17.35 11.52 6.06 Y 0.00 3.68 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -181.63 -181.63 -181.63 -181.63 -185.96 -185.96 -185.96 -185.96 -185.69 -185.69 -185.89 -185.96 -185.96 -185.96 -185.96 -181.63 -181.63 -181.63 -181.63 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 Pad Center (millimeters) X Y 0.00 0.00 -1.63 0.09 -1.88 0.00 -2.04 0.00 -2.20 0.00 -2.35 0.00 -2.51 0.00 -2.67 0.00 -2.83 0.00 -2.98 0.00 -2.97 -4.61 -2.82 -4.61 -2.69 -4.61 -2.54 -4.61 -2.28 -4.72 -2.00 -4.72 -1.67 -4.72 -1.39 -4.72 -1.16 -4.72 -1.02 -4.72 -0.88 -4.72 -0.38 -4.72 -0.10 -4.72 0.24 -4.72 0.52 -4.72 0.78 -4.61 1.04 -4.61 1.22 -4.61 1.39 -4.61 1.30 0.00 1.15 0.00 1.01 0.00 0.87 0.00 0.73 0.00 0.58 0.00 0.44 0.00 0.29 0.00 0.15 0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
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ORDERING INFORMATION Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F016D -120 DP C 1
DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature. TEMPERATURE RANGE C = Commercial (0C to +70C) I = Industrial (-40C to +85C) PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP = Waffle Pack 180 die per 5 tray stack DG = Gel-Pak(R) Die Tray 432 die per 6 tray stack DT = SurftapeTM (Tape and Reel) 2500 per 7-inch reel SPEED OPTION See Product Selector Guide and Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F016D Known Good Die 16 Megabit (2 M x 8-Bit) CMOS Flash Memory--Die Revision 1 5.0 Volt-only Program and Erase
Valid Combinations DPC 1, DPI 1, DGC 1, DGI 1, DTC 1, DTI 1, DWC 1, DWI 1
AM29F016D-120
Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.
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PACKAGING INFORMATION Surftape Packaging
Direction of Feed
Orientation relative to leading edge of tape and reel
AMD logo location
Gel-Pak and Waffle Pack Packaging
Orientation relative to top left corner of Gel-Pak and Waffle Pack cavity plate
16 mm
AMD logo location
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PRODUCT TEST FLOW
Figure 1 provides an overview of AMD's Known Good Die test flow. For more detailed information, refer to the Am29F016D product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in.
Wafer Sort 1
DC Parameters Functionality Programmability Erasability
Bake 24 hours at 250C
Data Retention
Wafer Sort 2
DC Parameters Functionality Programmability Erasability
Wafer Sort 3 High Temperature
DC Parameters Functionality Programmability Erasability Speed
Packaging for Shipment
Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack
Shipment
Figure 1.
AMD KGD Product Test Flow
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PHYSICAL SPECIFICATIONS
Die Dimensions, X x Y . . . . 186.61 mils x 208.66 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.74 mm x 5.30 mm Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 m Bond Pad Size . . . . . . . . . . . . . . 3.52 mils x 3.52 mils . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89.3 m x 89.3 m Pad Area Free of Passivation . . . . . . . . . .15.52 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 m2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Wafer Sort Test . . . . . . . . . . . . . . . . . . Sunnyvale, CA . . . . . . . . . . . . . . . . . . . . . . . . and Penang, Malaysia Manufacturing ID . . . . . . . . . . . . . . . . . . . . . 98J32AK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . CS49HS Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures.
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V Junction Temperature Under Bias . .TJ (max) = 130C Operating Temperature Commercial . . . . . . . . . . . . . . . . . . . 0C to +70C Industrial . . . . . . . . . . . . . . . . . . . -40C to +85C
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TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE
All transactions relating to unpackaged die under this agreement shall be subject to AMD's standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD's standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. AMD warrants unpackaged die of its manufacture ("Known Good Die" or "Die") against defective materials or workmanship for a period of one (1) year from date of shipment. This warranty does not extend beyond the first purchaser of said Die. Buyer assumes full responsibility to ensure compliance with the appropriate handling, assembly and processing of Known Good Die (including but not limited to proper Die preparation, Die attach, wire bonding and related assembly and test activities), and compliance with all guidelines set forth in AMD's specifications for Known Good Die, and AMD assumes no responsibility for environmental effects on Known Good Die or for any activity of Buyer or a third party that damages the Die due to improper use, abuse, negligence, improper installation, accident, loss, damage in transit, or unauthorized repair or alteration by a person or entity other than AMD ("Warranty Exclusions"). The liability of AMD under this warranty is limited, at AMD's option, solely to repair the Die, to send replacement Die, or to make an appropriate credit adjustment or refund in an amount not to exceed the original purchase price actually paid for the Die returned to AMD, provided that: (a) AMD is promptly notified by Buyer in writing during the applicable warranty period of any defect or nonconformity in the Known Good Die; (b) Buyer obtains authorization from AMD to return the defective Die; (c) the defective Die is returned to AMD by Buyer in accordance with AMD's shipping instructions set forth below; and (d) Buyer shows to AMD's satisfaction that such alleged defect or nonconformity actually exists and was not caused by any of the above-referenced Warranty Exclusions. Buyer shall ship such defective Die to AMD via AMD's carrier, collect. Risk of loss will transfer to AMD when the defective Die is provided to AMD's carrier. If Buyer fails to adhere to these warranty returns guidelines, Buyer shall assume all risk of loss and shall pay for all freight to AMD's specified location. The aforementioned provisions do not extend the original warranty period of any Known Good Die that has either been repaired or replaced by AMD. WITHOUT LIMITING THE FOREGOING, EXCEPT TO THE EXTENT THAT AMD EXPRESSLY WARRANTS TO BUYER IN A SEPARATE AGREEMENT SIGNED BY AMD, AMD MAKES NO WARRANTY WITH
RESPECT TO THE DIE'S PROCESSING OF DATE DATA , AND S HALL HAVE NO LIAB ILITY FOR DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR ANY OTHER THEORY, DUE TO THE FAILURE OF SUCH KNOWN GOOD DIE TO PROCESS ANY PARTICULAR DATA CONTAINING DATES, INCLUDING DATES IN AND AFTER THE YEAR 2000, WHETHER OR NOT AMD RECEIVED NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD's PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYER'S SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING KNOWN GOOD DIE AND AMD SHALL NOT IN ANY EVENT BE LIABLE FOR INCREASED MANUFACTURING COSTS, DOWNTIME COSTS, DAMAGES RELATING TO BUYER'S PROCUREMENT OF SUBSTITUTE DIE (i.e., "COST OF COVER"), LOSS OF PROFITS, REVENUES OR GOODWILL, LOSS OF USE OF OR DAMAGE TO ANY ASSOCIATED EQUIPMENT, OR ANY OTHER INDIRECT, INCIDENTAL, SPECIAL OR CONSEQUENTIAL DAMAGES BY REASON OF THE FACT THAT SUCH KNOWN GOOD DIE SHALL HAVE BEEN DETERMINED TO BE DEFECTIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representations to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD's warranty. Known Good Die are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of the Die can reasonably be expected to result in a personal injury. Buyer's use of Known Good Die for use in life support applications is at Buyer's own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale.
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REVISION SUMMARY Revision A (April 12, 2002)
Initial release.
Revision A+1 (June 11, 2002)
Ordering Information Deleted Gel Pak wafer tray from packaging type options. Manufacturing Information Corrected manufacturing ID. Added Sunnyvale, CA to wafer sort test locations.
Trademarks Copyright (c) 2002 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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